Modified Electromechanical Impedance-based Disbond...

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Modified Electromechanical Impedance-based Disbond Monitoring for Honeycomb Sandwich Composite Structure

Zhu, Jianjian, Wang, Yishou, Qing, Xinlin
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Journal:
Composite Structures
DOI:
10.1016/j.compstruct.2019.03.033
Date:
March, 2019
File:
PDF, 585 KB
2019
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