Modified Electromechanical Impedance-based Disbond Monitoring for Honeycomb Sandwich Composite Structure
Zhu, Jianjian, Wang, Yishou, Qing, XinlinJournal:
Composite Structures
DOI:
10.1016/j.compstruct.2019.03.033
Date:
March, 2019
File:
PDF, 585 KB
2019