Design, Fabrication, and Characterization of a Compact...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Design, Fabrication, and Characterization of a Compact Hierarchical Manifold Microchannel Heat Sink Array for Two-Phase Cooling

Back, Doosan, Drummond, Kevin P., Sinanis, Michael D., Weibel, Justin A., Garimella, Suresh V., Peroulis, Dimitrios, Janes, David B.
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2899648
File:
PDF, 6 KB
english, 2019
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