![](/img/cover-not-exists.png)
Handbook of 3D Integration (Design, Test, and Thermal Management) || Thermal Modeling and Model Validation for 3D Stacked ICs
Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, MuhannadVolume:
10.1002/97
Year:
2019
Language:
english
DOI:
10.1002/9783527697052.ch18
File:
PDF, 1.24 MB
english, 2019