Influence of electropolished copper substrate on morphology...

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Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 2019 / 2

Influence of electropolished copper substrate on morphology of electroplating self-supporting Ni films

Wang, Xiaoyu, Han, Yuncheng, Zhang, Jiachen, Li, Ziwei, Li, Taosheng, Zhao, Xueyan, Liu, Weiping
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Language:
english
Journal:
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
DOI:
10.1016/j.nima.2019.02.053
Date:
February, 2019
File:
PDF, 997 KB
english, 2019
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