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Handbook of 3D Integration (Design, Test, and Thermal Management) || Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application
Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, MuhannadVolume:
10.1002/97
Year:
2019
Language:
english
DOI:
10.1002/9783527697052.ch2
File:
PDF, 525 KB
english, 2019