Handbook of 3D Integration (Design, Test, and Thermal...

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Handbook of 3D Integration (Design, Test, and Thermal Management) || Power Delivery Network and Integrity in 3D-IC Chips

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad
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Volume:
10.1002/97
Year:
2019
Language:
english
DOI:
10.1002/9783527697052.ch3
File:
PDF, 735 KB
english, 2019
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