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Handbook of 3D Integration (Design, Test, and Thermal Management) || Physical Design Flow for 3D/CoWoS® Stacked ICs
Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, MuhannadVolume:
10.1002/97
Year:
2019
Language:
english
DOI:
10.1002/9783527697052.ch5
File:
PDF, 1.70 MB
english, 2019