Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints
Chan, Y. W., Ju, T. H., Hareb, Saeed A., Lee, Y. C., Wu, Jih-Shun, Lii, Mirng-JiVolume:
124
Year:
2002
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1451844
File:
PDF, 381 KB
2002