Preparation of the Low Cost SiC Wafer by the Layer...

Journal of the Japan Society for Precision Engineering 2017 Vol. 83; Iss. 9

Preparation of the Low Cost SiC Wafer by the Layer Splitting Method and the Wafer Direct Bonding Method

KAWAHARA, Takamitsu, HATTA, Naoki, SAKATA, Toyokazu, MINAMI, Akiyuki, YAGI, Kuniaki, UCHIDA, Hidetsugu, KOBAYASI, Motoki, TAKAGI, Hideki
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
83
Year:
2017
Journal:
Journal of the Japan Society for Precision Engineering
DOI:
10.2493/jjspe.83.833
File:
PDF, 1.69 MB
2017
Conversion to is in progress
Conversion to is failed