Comparison of fatigue life prediction methods for solder...

Microelectronics Reliability 2019 / 04 Vol. 95

Comparison of fatigue life prediction methods for solder joints under random vibration loading

Xia, Jiang, Yang, Lin, Liu, Qunxing, Peng, Qi, Cheng, LanXian, Li, GuoYuan
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Volume:
95
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.02.008
Date:
April, 2019
File:
PDF, 1.65 MB
english, 2019
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