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[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Wafer Scale Encapsulation of MEMS Devices
Park, Woo-Tae, Candler, Rob N., Li, Huimou J., Cho, Junghwa, Li, Holden, Kenny, Thomas W., Partridge, Aaron, Yama, Gary, Lutz, MarkusYear:
2003
Language:
english
DOI:
10.1115/IPACK2003-35032
File:
PDF, 583 KB
english, 2003