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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Effect of Bond Pad Surface Finish on AuSn Solder Bumping Using Laser Solder Jetting
Jaafar, Norhanani Binte, Choong, Chong SerYear:
2018
DOI:
10.1109/EPTC.2018.8654294
File:
PDF, 367 KB
2018