Direct surface in-situ activation for electroless...

Journal of the Taiwan Institute of Chemical Engineers 2019 / 04 Vol. 97

Direct surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film

Wang, Yuefeng, Hong, Yan, Chen, Qingguo, Zhou, Guoyun, He, Wei, Gao, Zhengping, Zhou, Xin, Zhang, Weihua, Su, Xinhong, Sun, Rui
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Volume:
97
Journal:
Journal of the Taiwan Institute of Chemical Engineers
DOI:
10.1016/j.jtice.2019.02.014
Date:
April, 2019
File:
PDF, 3.32 MB
2019
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