Microstructure of Bonding Interface and Influence of Sn plate in Welding of Lead for Aluminum Electrolytic Condenser
KUBOUCHI, Tatsuo, KAMIYA, OsamuVolume:
23
Year:
2010
Journal:
Journal of the Society of Materials Engineering for Resources of Japan
DOI:
10.5188/jsmerj.23.13
File:
PDF, 2.13 MB
2010