Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder...

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Journal of Materials Science: Materials in Electronics 2019 / 3

Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints

Park, Jae-Yong, Lee, Taeyoung, Seo, Wonil, Yoo, Sehoon, Kim, Young-Ho
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Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-01080-y
Date:
March, 2019
File:
PDF, 4.25 MB
english, 2019
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