Study on BEOL Failures in a Chip by Shear Tests of Copper...

Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps

Wang, Lei, Wang, Jun, Xiao, Fei
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Volume:
141
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4041714
Date:
February, 2019
File:
PDF, 4.14 MB
english, 2019
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