[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Impact of press-fit connector pin microstructure elastic response to PCB through-hole Cu wall interface long-term contact reliability
Palaniappan, Aruna, Li, Li, Lee, Tae-KyuYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654324
File:
PDF, 340 KB
english, 2018