[IEEE 2018 IEEE 20th Electronics Packaging Technology...

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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Wafer Level Through-polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

Hamelink, J., Huang, Z., Poelma, R. H., Kropf, R., Gallouch, M.
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Year:
2018
DOI:
10.1109/EPTC.2018.8654379
File:
PDF, 926 KB
2018
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