[IEEE 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2018.10.24-2018.10.26)] 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Electronic Packaging Solutions for Artificial Intelligence Applications (Invited talk)
Hu, Dyi-ChungYear:
2018
Language:
english
DOI:
10.1109/IMPACT.2018.8625827
File:
PDF, 444 KB
english, 2018