Advanced Boiling Cooling Technology Using a Compact Vessel...

Transactions of The Japan Institute of Electronics Packaging 2018 Vol. 11

Advanced Boiling Cooling Technology Using a Compact Vessel with a Low Water Level

Unno, Noriyuki, Yuki, Kazuhisa, Kibushi, Risako, Suzuki, Koichi
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Volume:
11
Year:
2018
Language:
english
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.11.E18-010-1
File:
PDF, 1.08 MB
english, 2018
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