[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Correlating Printing Performance of Solder Paste with Its Rheology
Shrivastava, Saurabh, Das, Ansuman, C, SathiyanarayananYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654376
File:
PDF, 181 KB
english, 2018