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Influence of Phase Inhomogeneity on Electromigration Behavior in Cu/Sn-58Bi/Cu Solder Joint
Qin, Hongbo, Luan, Xinghe, Yue, WuLanguage:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07117-6
Date:
March, 2019
File:
PDF, 1.98 MB
english, 2019