Study of Copper Residue Generated During Cu CMP Process

Study of Copper Residue Generated During Cu CMP Process

YAMADA, Yohei, KONISHI, Nobuhiro, KUROKAWA, Shuhei, DOI, Toshiro
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Volume:
75
Year:
2009
Journal:
Journal of the Japan Society for Precision Engineering
DOI:
10.2493/jjspe.75.617
File:
PDF, 3.55 MB
2009
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