A Study on the Optimization of Electroplating Conditions...

International Journal of Precision Engineering and Manufacturing 2019 / 3 Vol. 20; Iss. 3

A Study on the Optimization of Electroplating Conditions for Silicon Vias Using the Taguchi Experimental Design Method

Park, Byung-Geon, Kim, Seon Gyeong, Ko, Jong Soo
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Volume:
20
Language:
english
Journal:
International Journal of Precision Engineering and Manufacturing
DOI:
10.1007/s12541-019-00087-z
Date:
March, 2019
File:
PDF, 909 KB
english, 2019
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