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Study on Correction Method for Die Position Deviation caused by adhesive tape puncture
Wu, Tao, Lou, Yuxian, Wu, Fupei, Li, BinYear:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2883351
File:
PDF, 1.11 MB
english, 2018