[IEEE 2018 International Symposium on Semiconductor Manufacturing (ISSM) - Tokyo, Japan (2018.12.10-2018.12.11)] 2018 International Symposium on Semiconductor Manufacturing (ISSM) - Process Control Technique to Reduce Wafer Warpage for Trench Field Plate Power MOSFET
Kato, Hiroaki, Kobayashi, Kenya, Nishiguchi, Toshifumi, Shimomura, SayaYear:
2018
Language:
english
DOI:
10.1109/issm.2018.8651148
File:
PDF, 356 KB
english, 2018