On the mechanism of Sn tunnelling induced intermetallic...

Journal of Alloys and Compounds 2019 / 06 Vol. 791

On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates

Ren, Guang, Collins, Maurice N.
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Volume:
791
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2019.03.244
Date:
June, 2019
File:
PDF, 2.71 MB
english, 2019
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