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Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate
Bao, Nifa, Hu, Xiaowu, Li, QinglinLanguage:
english
Journal:
Materials Research Express
DOI:
10.1088/2053-1591/ab155f
Date:
April, 2019
File:
PDF, 1.70 MB
english, 2019