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[IEEE 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Chandigarh, India (2018.12.16-2018.12.18)] 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Transient and Crosstalk Analysis of Doped and Dielectric Inserted MLGNR Interconnects
Yeleti, Haritha, Kumar, Mekala Girish, Chandel, Rajeevan, Agrawal, YashYear:
2018
Language:
english
DOI:
10.1109/EDAPS.2018.8680856
File:
PDF, 142 KB
english, 2018