Development of Reliability and Moldability on Fine Pitch...

Journal of Electronic Packaging 2001 Vol. 123; Iss. 1

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

Aihara, Takashi, Ito, Shingo, Sasajima, Hideaki, Oota, Ken
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Volume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1329129
File:
PDF, 675 KB
english, 2001
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