Assessment of Some Integrated Cooling Mechanisms for an...

Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module

Pang, Y., Scott, E., van Wyk, J. D., Liang, Z.
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Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429703
File:
PDF, 1.28 MB
english, 2007
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