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Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
Pang, Y., Scott, E., van Wyk, J. D., Liang, Z.Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429703
File:
PDF, 1.28 MB
english, 2007