A Comparison of the Solderability of Wrought and Plated...

Journal of Electronic Packaging 1990 Vol. 112; Iss. 3

A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

Woychik, C. G., Trivedi, A. K.
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Volume:
112
Year:
1990
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2904371
File:
PDF, 8.10 MB
english, 1990
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