Understanding the Cyclic Mechanical Behavior of Lead/Tin...

Journal of Electronic Packaging 1991 Vol. 113; Iss. 2

Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder

Tien, J. K., Hendrix, B. C., Attarwala, A. I.
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Volume:
113
Year:
1991
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905376
File:
PDF, 642 KB
english, 1991
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