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Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate
Lau, J., Subrahmanyan, R., Rice, D., Erasmus, S., Li, C.Volume:
113
Year:
1991
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905379
File:
PDF, 1.81 MB
english, 1991