Effects of Solder Joint Voiding and Seating Plane Stability...

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

Schwiebert, M. K.
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Volume:
116
Year:
1994
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905510
File:
PDF, 503 KB
english, 1994
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