Lifetime Prediction of Solder Materials

Lifetime Prediction of Solder Materials

Zubelewicz, A., Berriche, R., Keer, L. M., Fine, M. E.
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Volume:
111
Year:
1989
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.3226531
File:
PDF, 1.15 MB
english, 1989
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