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Numerical and experimental investigation on heat transfer of multi-heat sources mounted on an array of printed circuit boards in a rectangular case
Thepsut, Warakorn, Pratinthong, NarisLanguage:
english
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2019.04.032
Date:
April, 2019
File:
PDF, 1.79 MB
english, 2019