Technology and Development Trends of the Thin Copper Foil with Carrier for PCB; PCB向けキャリア付極薄電解銅箔の最近の技術開発動向;
IIDA, HirotoVolume:
68
Journal:
Journal of The Surface Finishing Society of Japan
DOI:
10.4139/sfj.68.488
Date:
September, 2017
File:
PDF, 1.19 MB
2017