Copper–Nickel Alloy Plating to Improve the Contact...

Electronic Materials Letters 2019 / 5 Vol. 15; Iss. 3

Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells

Lee, Sang Hee, Lee, Doo Won, Lim, Kyoung-jin, Shin, Won-suk, Kim, Jeong
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Volume:
15
Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-019-00134-x
Date:
May, 2019
File:
PDF, 1.80 MB
english, 2019
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