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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - SIPI Co-Sim: Signal Performance of Super Speed Differential I/O with Power Referencing Design
Chew, Li Wern, Ong, Paik WenYear:
2018
DOI:
10.1109/EPTC.2018.8654326
File:
PDF, 311 KB
2018