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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Wafer Level Reliability Characterization of 2.5D IC packages
Jayabalan, Jayasanker, Chinq, Jong Ming, Chidambaram, Vivek, Siang, Sharon Lim Pei, Ming, Calvin Chua Hung, Bhattacharya, SuryaYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654428
File:
PDF, 18 KB
english, 2018