[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Package Level Warpage Simulation of Fan-out Wafer Level Package (FOWLP) Considering Viscoelastic Material Properties
Chen, Zhaohui, Zhang, Xiaowu, Lim, Sharon Pei Siang, Lim, Simon Siak Boon, Lau, Boon Long, Han, Yong, Jong, Ming Chinq, Liu, Songlin, Wang, Xiaobai, Andriani, YosephineYear:
2018
Language:
english
DOI:
10.1109/eptc.2018.8654264
File:
PDF, 29 KB
english, 2018