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Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan-Out Wafer-Level Packaging (FO-WLP)
Keser, Beth, Kroehnert, SteffenVolume:
10.1002/97
Year:
2019
Language:
english
DOI:
10.1002/9781119313991.ch14
File:
PDF, 3.50 MB
english, 2019