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Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies || Embedding of Active and Passive Devices by Using an Embedded Interposer
Keser, Beth, Kroehnert, SteffenVolume:
10.1002/97
Year:
2019
Language:
english
DOI:
10.1002/9781119313991.ch9
File:
PDF, 1.05 MB
english, 2019