Integration of a (–Cu–S–)n plane in a metal–organic...

Nature Communications 2019 / 12 Vol. 10; Iss. 1

Integration of a (–Cu–S–)n plane in a metal–organic framework affords high electrical conductivity

Pathak, Abhishek, Shen, Jing-Wen, Usman, Muhammad, Wei, Ling-Fang, Mendiratta, Shruti, Chang, Yu-Shin, Sainbileg, Batjargal, Ngue, Chin-May, Chen, Ruei-San, Hayashi, Michitoshi, Luo, Tzuoo-Tsair, Chen
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Volume:
10
Journal:
Nature Communications
DOI:
10.1038/s41467-019-09682-0
Date:
December, 2019
File:
PDF, 1.59 MB
2019
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