[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - A Study of the Growth Rate of Cu-Sn Intermetallic Compounds for Transient Liquid Phase Bonding during Isothermal Aging
Jeong, So-Eun, Jung, Seung-Boo, Yoon, Jeong-WonYear:
2018
Language:
english
DOI:
10.1109/EPTC.2018.8654441
File:
PDF, 238 KB
english, 2018