[IEEE 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2018.10.24-2018.10.26)] 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - LTPS-TFTs integrated in RDL for High-End FOPLP Application
Lai, Hsin-Cheng, Chung, Yu-Hua, Feng, Chieh-Wei, Yu, Cheng-Hung, Chen, Wei-Han, Yu, Dzu-How, Chang, Tzu-Yen, Chu, Chien-Hsun, Wang, Terry Tai-JuiYear:
2018
Language:
english
DOI:
10.1109/IMPACT.2018.8625836
File:
PDF, 439 KB
english, 2018