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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Warpage Prediction and Optimization for Embedded Silicon Fan Out (eSiFO) Wafer Level Packaging based on an Extended Theoretical Model

Chen, Cheng, Yu, Daquan, Wang, Teng, Xiao, Zhiyi, Wan, Lixi
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2019.2907295
File:
PDF, 888 KB
english, 2019
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