![](/img/cover-not-exists.png)
[IEEE 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Stockholm (2018.9.26-2018.9.28)] 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Rheology Investigations of Highly Loaded Thermally Conductive Silicone Composites
Descamps, Pierre, Hanssen, Darren, Becerra, AndresYear:
2018
Language:
english
DOI:
10.1109/therminic.2018.8593292
File:
PDF, 606 KB
english, 2018