Sawing stress of SiC single crystal with void defect in...

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Sawing stress of SiC single crystal with void defect in diamond wire saw slicing

Gao, Yufei, Chen, Yang
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Language:
english
Journal:
The International Journal of Advanced Manufacturing Technology
DOI:
10.1007/s00170-019-03579-4
Date:
March, 2019
File:
PDF, 2.51 MB
english, 2019
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